CELLESTA+ is new single wafer cleaning tool that uses TEL's market leading Lithography system wafer handling technology to provide high reliability and throughput. The new system has 12 process spin chamber configuration, enabling maximum throughput of 330 wafers per hour. CELLESTA+ has two important features to reduce overall system footprint and maximize performance: a new compact spin unit design and onboard chemical supply. TEL's original advanced IPA drying technology eliminates the generation of watermarks and damage on sensitive structures. CELLESTA+ also includes enhanced atomized spray(AS3), which provides larger process window for high particle removal efficiency(PRE) with no pattern or surface structure damage.

• Pre Diffusion/CVD cleaning
• Post etch cleaning
• Wet Etching

• Maximum 330 wafers per hour
• New compact 12 process spin chamber
• On board chemical supply system
• TEL original Advanced IPA drying technology for watermark-free drying performance
• Enhanced atomized spray(AS3) for high PRE with no pattern damage

• *CELLESTA is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.
• *Ingenio is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.