TEL's Surface Preparation Systems group produces advanced automated wet surface preparation systems designed specifically for sub-quarter micron FEOL/BEOL cleaning, etching, and photoresist stripping in 200mm and 300mm mass production environments. TEL's sophisticated tools outperform competitive systems in process performance and Cost-of-Ownership.

When wafers first arrive in a cleanroom, or after they have completed a process cycle, they undergo a cleaning procedure to remove foreign particles and/or contamination. Surface preparation systems use one of several methods to eliminate particles, such as brushes or sprays, depending on the type of cleaning required.