TEL is the world's second largest manufacturer of semiconductor production equipment. Our diverse product line, used to manufacture chips, is supported with world-class research by TEL employees and productive collaboration with industry consortia, universities, and customers from around the world.
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Vertical thermal processing systems for general oxidation and annealing, deposition, LPCVD, and a variety of other applications. |
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Tools used intensively in photolithography to deposit uniform thin films used to define millions of microscopic circuit elements on the surface of silicon. |
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Equipment using high-energy ions from a plasma to remove materials for dual-damascene, poly gate, low-k, self-aligned contact (SAC) and deep trench pattern formation. |
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Automated wet and dry chemistry systems used to remove the contaminants from the wafer surface and to prepare the surface for further processing. |
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Equipment employing advanced chemical vapor deposition (CVD), oxidation or nitridation technologies to deposit films including tungsten, tungsten silicide, titanium, titanium nitride, and tantalum oxide. |
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Equipment providing electrical testing of finished devices on whole or diced wafers or in wafer-level packages. |
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Systems using a directed energetic chemical beam to produce extremely shallow doping, thin film deposition or surface modifications. |
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Systems using programmed processes to compensate for electrical or material variations |
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High-speed computational platform for both stand-alone and integrated metrology (IM) applications using non-destructive scatterometry-based data to determine device profiles, critical dimensions, and multiple layer film thickness. |
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E-beam wafer defect inspection system for a variety of FEOL & BEOL physical and voltage contrast defect applications. |
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