TEL's Single Wafer Deposition group provides solutions to the most advanced CVD tungsten, tungsten silicide, titanium, titanium nitride, and tantalum oxide process requirements for DRAM, Flash and Logic applications. TEL's Trias metallization system meets the industry's high standards of performance while also demonstrating ease of maintenance and environmental responsibility. With technology that yields superior film properties for thin-film applications, TEL has grown to become the second largest metal CVD supplier with over 45% of the worldwide market.

Chemical Vapor Deposition (CVD) is a process by which thin layers of various materials are formed on a substrate from a gaseous mixture of reactive chemicals. The deposited materials are then patterned to create the individual elements that make up the integrated circuit.