TEL Epion Inc. (TEI) provides systems for surface modification of semiconductor materials including physical and chemical modification processes and doping. These are called infusion processes. The TEI nFusiontm product is capable of processing 200mm to 300mm wafers for logic and memory applications.

Infusion is the process of introducing chemistry to the wafer surface by Gas Cluster Ion Beam (GCIB). GCIB is an energetic chemical beam that infuses chemicals into the substrate to modify its surface. GCIB can achieve surface effects not possible by any other method. Infusion can be used for Ultra Shallow Junction formation, Poly Doping, and other shallow processes.