The Successio-Series system has evolved from the 5th generation single-chamber system by reducing the size of the transfer unit by 25%. Its simple design reduces downtime caused by unexpected problems. The system is designed and developed to create a uniform plasma density in process chambers and to increase the efficiency of etching.

• Silicon layer
• Insulating layer
• Metal layer
• Ashing

• Substrate size : Successio
  <Standard> 1500mm×1800mm
• Single-chamber system
• Chamber mode : PE/ECCP mode Selectable
• P/C Open/Close : Slide & rotation (TEL original)