The SE series is plasma etch/ash system developed for 5th generation mass production lines. It achieves the same high etching rate and etching uniformity as the 4th generation system by utilizing knowledge accumulated through development of the ME and HT Series. The system employs TEL's original transfer system and optimized parts wherever possible, thereby achieving the high-speed handling performance of the previous series.

• Silicon layer
• Insulating layer
• Metal layer
• Ashing

• Substrate size : SE-1310T
  <Standard> 1100mm×1300mm
• Single-chamber system
• New control system : GUI control
• Chamber mode : PE/RIE/ECCP/ICP mode Selectable
• P/C Open/Close : Slide & rotation (TEL original)