The HT Series, FPD plasma etch/ash system has a maximum capacity of three chambers. It realizes excellent cost performance, thereby meeting the demands for large FPD mass production lines. It maintains the proven reliability of the ME series, which has a solid shipment record, and achieves a high transfer speed through the adoption of a unique transfer system. Additionally, an excellent shape controll ability was achieved in the metal etching by "ECCP mode", where the standard was adopted with over one meters large-sized substrate of LCD manufacturing line.

• Silicon layer
• Insulating layer
• Metal layer
• Ashing

• Substrate size : HT910
  <Standard> 730mm×920mm
• Multi-chamber system : Max 4 Chamber
• New control system : GUI control
• Chamber mode : PE/RIE/ECCP/ICP mode Selectable
• High transfer speed, two load lock modules which execute vent & pumping repeatedly
• P/C Open/Close : Slide & rotation (TEL original)