TEL is the world market share leader in dielectric etching. Our etch systems achieve first-rate process results on a wide range of plasma etch applications, including: SAC, Dual Damascene, Low-k dielectrics, Poly Gate, and Silicon Deep Trench Etch. The robust designs of our tools deliver production-worthy etch processes that are repeatable chamber-to-chamber.

Plasma etching occurs when a photoresist film is patterned onto the wafer, and the pattern is transferred to the film below. Within an etch chamber, highly reactive plasma gasses react with the wafer to remove the film where the pattern leaves it exposed. Once complete, the wafer has a dielectric film with a pattern that is ready to receive tungsten or copper, which serves as an interconnection to the next layer.