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eSCAN 300

eScan 300

The eScan 300, a collaboration between TEL and Hermes MicroVision, Inc., is the most advanced e-beam defect inspection tool available to the semiconductor industry. Able to accommodate both 300mm and 200mm wafers simultaneously, the eScan is designed to accelerate 65nm and 45nm technology development and production.

Applications

  • FEOL physical and voltage contrast defects
    • Gate leakage
    • Nickel silicide piping
    • Poly stringers
  • BEOL physical and voltage contrast defects
    • Tungsten CMP
    • Copper CMP

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