| Nov 29, 2010 |
Tokyo Electron (TEL) introduces a new feature of 300mm Plasma Treatment Reactor, Trias™ e+ SPAi |
| Nov 29, 2010 |
TEL Begins Accepting Orders for “Certas WING™” (High Throughput Gas Chemical Etch System) |
| Nov 25, 2010 |
Tokyo Electron Limited (TEL) Introduces New 300mm High Productivity Plasma ALD Nitride System, TELINDY PLUS™ IRad™ SA |
| Nov 24, 2010 |
TOKYO ELECTRON and TANAKA KIKINZOKU KOGYO succeeded the Joint Development of Innovative Recycling Process of Ruthenium Precursors. -Enabling the Reuse of Ruthenium Precursors Normally Discarded- |
| Nov 11, 2010 |
Tokyo Electron and Epson Conclude Joint Development Agreement for OLED Display Manufacturing Technology |
| Nov 2, 2010 |
TEL Amends Dividend Policy and Revises Dividend Forecast |
| Nov 2, 2010 |
Notice Concerning Payment of Interim Dividends from Retained Earnings |
| Nov 2, 2010 |
Announcement on Financial Forecast Revision |
| Nov 2, 2010 |
TEL Announces Changes in the Important Personnel |
| Nov 2, 2010 |
2Q FY2011 Financial Announcement |
| Oct 20, 2010 |
Establishment of Production Site in China |
| Sep 17, 2010 |
Tokyo Electron Announces Organizational Changes |
| Sep 7, 2010 |
Establishment of a Research Association of Advanced Lithium Ion Capacitor (LIC) Technology |
| Jul 30, 2010 |
TEL Announces Organizational and Personnel Changes |
| Jul 30, 2010 |
1Q FY2011 Financial Announcement |
| Jul 30, 2010 |
Announcement on Financial Forecast and Dividend Forecast Revision |
| Jun 18, 2010 |
TEL Announces Personnel Changes |
| Jun 15, 2010 |
Tokyo Electron Introduces Probus-SiC™, a CVD Tool used in Epitaxial Film Growth on Silicon Carbide Substrates |
| Jun 7, 2010 |
Tokyo Electron Limited (TEL) and Ebara Corporation (Ebara) Mutually Agree on Joint Evaluation about Ruthenium Based Technology for Advanced Copper Interconnect |
| May 27, 2010 |
Notice of fiscal year 2010 annual general meeting of shareholders |
| May 12, 2010 |
Announcement for Executive Management，Important Personnel and Organizational Changes |
| May 12, 2010 |
Notice Concerning Payment of Dividends from Surplus Earnings |
| May 12, 2010 |
Financial Review for the Year Ended March 31, 2010 |
| Apr 27, 2010 |
Announcement on Financial Forecast Revision |
| Mar 25, 2010 |
Announcement on changes in CEO, corporate organization, and important personnel |
| Mar 25, 2010 |
Announcement on Establishment of Subsidiary |
| Mar 25, 2010 |
Announcement on Financial Forecast Revision |
| Mar 25, 2010 |
Tokyo Electron Introduces the Tactras™ RLSA™ Etch, a New Etching System with Revolutionary Breakthrough Plasma Technology |
| Mar 16, 2010 |
Tokyo Electron Receives Intel's Preferred Quality Supplier Award |
| Feb 24, 2010 |
TEL Joins SEMATECH’s Lithography Program at UAlbany NanoCollege |
| Feb 18, 2010 |
Tokyo Electron Limited (TEL) Announces Joint Collaboration for Advanced Double-Patterning Technology |
| Feb 16, 2010 |
Tokyo Electron (TEL) and imec expand collaboration on EUVL |
| Feb 9, 2010 |
TEL Announces Organizational and Personnel Changes |
| Feb 9, 2010 |
3Q FY2010 Financial Announcement |
| Feb 3, 2010 |
TEL Donates to Haiti Earthquake Relief and Recovery Efforts |
| Feb 1, 2010 |
Tokyo Electron (TEL) Introduces “Trias e+” a New Cluster-Tool Platform for Single Wafer CVD Processes |
| Jan 27, 2010 |
Announcement on Financial Forecast Revision |
| Jan 22, 2010 |
Tokyo Electron Announces Construction of New Miyagi Plant |
