TOKYO - Tokyo Electron Limited announced today that it will begin accepting orders in April 2007 for its newest 300mm etching system, the Tactras Vigus. TEL's latest state-of-the-art dielectric etch system is specifically targeted at hp45 (half pitch) memory and 32 nm logic technology.

Key to the Tactras Vigus system design is its ability to demonstrate superior performance on high aspect ratio contact (HARC) etch, and advanced damascene integration schemes created by leading-edge customers. The new system also offers higher overall etch rates than previous system designs, excellent CD control and high selectivity for newer stop layer films.

The Tactras platform can incorporate up to six chambers for maximum productivity and flexibility. In addition to the Vigus, the Tactras can support other advanced chamber designs targeted at specific integration challenges, such as low-k damage restoration and backside polymer removal.

The Tactras Vigus employs TEL's most advanced expertise in chamber and platform design to produce a tool that offers unparalleled performance in chamber to chamber matching and maximum tool uptime. Additional productivity improvements include TEL's overall equipment effectiveness (OEE) system, which significantly reduces particles and increases tool uptime. Furthermore, the system's user interface employs a unique software system that offers various new features, such as on board best known methods (BKMs). All of these combined benefits signify an evolutionary step for Tokyo Electron as the world leader in plasma etch technology.

*Tactras, Vigus are trademarks of Tokyo Electron Limited in Japan and other countries.