SANTA CLARA, CA-Timbre Technologies, Inc., a TEL company, today announced the adoption of their Optical Digital Profilometry - Mask (ODP-M) CD and profile metrology product, by another major mask shop, TSMC, of Taiwan.

ODP-M provides both two-dimensional and three-dimensional metrology capability for photomask applications, and can accurately measure lines/spaces as well as contact holes. The technology precisely measures binary masks, advanced phase-shift masks, chromeless masks, and EUV masks. Based on optical scatterometry, ODP-M translates diffracted broadband light into accurate physical profiles of mask structures, etch depths and underlying film thicknesses. It provides fast and accurate profile metrology of advanced photomasks. Unlike CD-SEMs (which require vacuum), destructive X-SEMs or slower AFMs, scatterometry is fast, non-destructive and is performed in an ambient environment.

TSMC chose ODP-M because of its versatility and wide range of insights for its advanced 32nm phase-shift masks. Timbre's solution provides more information, more precise critical dimensions (CD), full profiles, including etch depth, and all-in-one measurement at the highest data integrity and lowest cost per measurement. Coupled with the speed of the measurement, ODP was the clear choice for TSMC.

"The adoption of the ODP-M solution for mask applications by TSMC signifies broad industry acceptance of the ODP technology. It has now been successfully implemented at key mask shops worldwide," said Dr. Sanjay Yedur, ODP Product Manager. "ODP technology is now available as a fab-wide solution, from front-end mask applications through back end wafer processing. For our customers, this provides a reliable and consistent metrology solution through the complete manufacturing process."

The ODP-M solution is used in conjunction with the Atlas-M Advanced CD and thin-film solution from Nanometrics. Inc.