TOKYO – Tokyo Electron Limited (TEL) announced Thursday that it began accepting volume orders for its Certas™ 200 and 300mm dry chemical etching systems on November 1, 2005.

Certas, a fully automated single wafer cleaning system, provides advanced surface pre-clean capabilities at the 45nm technology node and beyond. The system eliminates wafer and equipment damage by using a dry cleaning application with a non-plasma source, reducing cost-of-ownership and increasing tool reliability and uptime.

The system also incorporates automated dry cleaning units, which dramatically reduce the cost of consumables by eliminating wet chemicals, DI water, and the associated exhaust requirements. Certas exhibits reverse etch selectivity when compared with traditional DHF wet cleans, which translates to a more controlled etch rate and provides unique Si dioxide selectivities, thereby enabling new integrated process integration opportunities.