TOKYO – TEL announced today that the company will begin accepting orders for the new 300mm vertical thermal processing system, the TELINDY, in early 2006.

The TELINDY integrates the benefits of TELFORMULA's sequential processing of varied film stacks and the Alpha 303i's proven productivity. The system demonstrates high productivity through the combined advantages of minimized overhead time, an optimized gas delivery system, and a larger load size of 125 wafers. The new concept also offers high-speed robotics, a faster ramp-up and rapid cooling system. Additionally, TELINDY provides significant cost-of-ownership advantages over conventional furnaces.

The TELINDY is capable of processing nitride and oxide films. Additional advanced films, such as LPRO (Low Pressure Radical Oxidation), are planned for release in 2006.

TEL continues to work with leading edge logic and memory device manufacturers to develop films targeted at the 45nm node and beyond.