Tokyo – Tokyo Electron (TEL), the leader in Dielectric etch systems, today announced the release of the Tactras™ advanced wafer handling platform. The system will support both polysilicon etch and dielectric etch chambers. Orders for the Tactras will begin in June 2006.

TEL has been working with key customers in developing the company's next generation etch platform to meet the demands of advanced 300mm fabs. Building upon the success of the previous vacuum based cluster tools, the Tactras hosts an advanced robotic system that offers high-speed and efficient wafer transfer. Benefits of the new system include higher throughput, minimal footprint and greater process flexibility. The Tactras also includes TEL's Advanced Navigation System, which can track a wafer in real time and ensure superior accuracy of wafer placement.

In addition to the major hardware improvements of the Tactras, the platform supports TEL's newest technologies for particle control, optimized throughput and minimal downtime for maintenance. The new system uses less electrical power than previous versions and supports advanced features, such as point of use dry pumps and a more compact gas management system, both of which improve the system's overall equipment effectiveness and efficiency (OEE).